Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.

Our wafer mounting systems laminate tape/film to wafer and dicing frames without bubbles prior to the singulation/dicing process. Repeatable and stable process of wafer mounter improves the yield. We offer a wide range of wafer mounting equipment from R&D to semi-production.

Ultron Systems' Model UH114 & UH115 Series Mounters set the benchmark for both control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount.

The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in …

This is a stand-alone system, and the ideal wafer multi-mounting system for ultra-thin wafer manufacture. From UV irradiation following the back grinding process, to alignment, mounting on dicing frames, and peeling of Back Grinding Tape, all in a single machine.

Used to mount a wafer onto a frame with commercially available tapes. Short setup times and high versatility - perfect for high mix or medium volume; Bubble-free application of tape on wafers & corresponding frames up to 8" Carbon tissue used to protect the sensitive surface during the mounting process

A wafer mounter is a type of equipment used in semiconductor manufacturing to mount and align individual wafers onto a carrier (such as a temporary or permanent wafer chuck) prior to processing. The goal of the wafer mounter is to securely hold the wafer in place during processing and minimize contamination or damage to the wafer surfaces.

Wafer mounting and taping equipment is used in the assembly and packaging of integrated circuits (ICs). It is used to mount the wafers onto a carrier tape or onto a dicing tape.

Suitable for the highest requirements in process stability, reproducibility, and homogenous adhesion for a variety of flat wafers and substrates. The cycle time typically takes less than 90 seconds. V-200 for up to Ø8"

Crafted with the primary purpose of automatically affixing wafers onto tape, the ADT 967 Semi-Automatic Wafer Mounting System showcases a harmonious blend of intelligence and user-friendliness. This remarkable product holds significant value and is the ultimate selection for mounting during production processes.