LM10524 is an advanced PMU containing three configurable, high-efficiency buck regulators for supplying variable voltages. The device is ideal for supporting ASIC and SOC designs for SSD and Flash drives.

Viking Technology’s BGA SSD is an embedded solid state drive (eSSD) solution designed and optimized for a wide range of embedded/industrial applications. This BGA SSD leverages advanced NAND technologies and NAND geometry (iTLC) to deliver high capacity drives in the densest BGA package (20mm x 16mm).

Aug 27, 2024 · The key advantages of BGA SSD: Integrated directly onto the motherboard, BGA SSDs remove the need for bulky connectors and cables. They allow for high density, meaning they're far more compact as a storage option creating better efficiency and cost savings.

Flexxon’s BGA SSD has the Industrial SATA 3 interface with BGA form factor. Oue BGA SSD features Advanced Flash Management, Low Power Management, power loss protection, advanced device security (secure erase and write protect), data compression technique and Adaptive Approach to Performance Tuning.

May 3, 2021 · ATP brings NVMe level performance to a tiny form factor: the N700 Series PCIe Gen3 x4 NVMe M.2 Type 1620 heatsink ball-grid array solid state drive (HSBGA SSD).

With a wide operating temperature range of -40°C to 105°C and enhanced ruggedization, BGA design offers excellent resilience against shocks, vibrations, and extreme conditions. It features direct PCB mounting, removing connectors to save …

Silicon Motion’s new FerriSSD might be small in size, but it is the world’s fastest BGA-SSD, delivering exceptional performance and high reliability for continual operation – making it the perfect choice for Boot SSD. The tables below show FerriSSD performance specs in various configuration and modes (SLC or MLC).

The Samsung PM971 is the industry's first NVMe™ PCIe® SSD in a single BGA (Ball Grid Array) package that is amazingly small, super powerful and impressively power efficient. Ultra-compact for ultra-thin devices The PM971 contains all the essential components of an SSD—NAND flash, DRAM and controller—in one small chip.

Our ball-grid-array (BGA) embedded SSD technology packs NAND flash, DRAM memory, and a controller chip into a package that weighs less than half a penny and is smaller than a postage stamp. Yet, the performance of this tiny SSD powerhouse is …

Dec 27, 2021 · Based on the technical experiences in the field of embedded memory chips and a profound understanding towards the market, in 2019, BIWIN rolled its E009 series PCIe Gen3 version of BGA SSD. This series features small size, large capacity, high performance, low power consumption and more.