
R-578Y (G) | Panasonic Industrial Devices
Peel Strength (1 Oz. Cu) (kN/m)
R-578Y(N) Low Dk glass cloth/H-VLP2 R-578Y(GN) Low Dk glass cloth/H-VLP2 0.4mm pass pass 0.6mm pass pass φ0.3mm 0.5mm pass pass Frequency (GHz) Transmission loss (dB/m) Construction Microstrip line Measurement Frequency De-embedded Measurement line 2 port S-Parameter 10MHz-110GHz TRL method adjust to 50Ω(Zo)-200 0 20 40 60 80 100
General Properties / Laminate R-578Y(GE) & R-578Y(GN) Sample thickness : 29.5 mil = 0.750 mm ( Core Type 30 ) Note 1 : Balanced-type Circular Disk Resonance Method [ IEC 63185 (2020) ]
and MEGTRON7 R-578Y(N), improving transmission loss by about 30% (@28GHz). Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials Laminate R-579YS(U)/(N) Prepreg R-569YS(U)/(N) Laminate R-579Y(U)/(N) Prepreg R-569Y(U)/(N) Dk 3.08 Df 0.0012 @14GHz Tg (DMA) 220℃ ...
Panasonic Industry MEGTRON6 MEGTRON7 Product Number Material Construction Copper Foil Combination R-5775(S) E-glass cloth or Low Dk-glass cloth
General Properties / Laminate R-578Y(N) Sample thickness : 29.5 mil = 0.750 mm ( Core Type 30 ) Note 1 : Balanced-type Circular Disk Resonance Method [ IEC 63185 (2020) ]
R-578Y(R) - Multi-layer Circuit Board Materials for ICT ... - Panasonic
Product specifications and documents of R-578Y(R), Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series, Panasonic for Asia, Oceania, Middle East, & Africa.
Materials for Use in Fabricating Recognized Printed Wiring Boards …
R-578Y (Note 6) (Note 15) Metal clad industrial laminates for use in single layer printed wiring boards with copper on one or both sides furnished as sheets or rolls
E81336 for Panasonic Industry Co., Ltd. | UL Solutions - UL …
Return to results :: Keyword: "R-578Y" Polymeric Materials - Filament-wound Tubing, Industrial Laminates, Vulcanized Fiber, and Materials for Use in Fabricating Recognized Printed Wiring Boards - Component
Ultra-low transmission loss Highly heat resistant Multi-layer circuit ...
Due to our industry leading low dielectric constant and dissipation factor, these materials are suitable for high-speed data transmission by servers and routers using high-layercount, large-size PCB designs. There might be some differences in UL certification conditions between the existing part numbers and the new part numbers.