To meet current operational needs for the Department of Defense, the Trusted and Assured Microelectronics (T&AM) Program drives modernization of defense systems through access to …

Nov 10, 2022 · With Intel on schedule to deliver production-grade MCPs to the DIB in 2023, the objective of STAMP is to prototype a strong and swift transition path that enables the DoD to …

Be one of the first to learn about the upcoming Stimulating Transition for Advanced Microelectronics Packaging (STAMP) project with Dr. Darren Crum, the USD R&E Team, and …

Consult the appropriate Military Service Trademark Licensing Program Office below for a written determination regarding your request to use Military Service insignia. Department of Defense …

Oct 24, 2022 · The new pilot, called the Stimulating Transition for Advanced Microelectronics Packaging project, or STAMP, seeks to accelerate the next phase of the existing State-of-the …

Today’s awards support the Department’s mission to promote microelectronics supply chain security and accelerate U.S. development of the very best in circuit design, manufacturing, …

What is the role of DISA’s Advanced Concepts and Experimentation Office? DISA’s Advanced Concepts and Experimentation (ACE) Office within the Chief Technology Office is the entry …

Projects execute within the Department of Defense (DoD) Planning, Programming, Budgeting, and Execution (PPBE) process. In other words, when a new capability need is identified, a …

Apr 6, 2023 · Utilizing the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Oth e r Transaction Agreement (OTA), the SHIP Program has partnered with Intel …

OUSD (R&E)'S MICROELECTRONICS PROGRAMS ARE ALIGNED TO DEVELOP AND DELIVER NEW DEFENSE CAPABILITIES.