After preparing a large number of MEMS devices on a silicon wafer, individual dies have to be separated, which is called die preparation in semiconductor technology.

May 25, 2021 · This article discusses the most common specifications for MEMS silicon dies, including offset, sensitivity, and non-linearity.

We offer MEMS silicon dies in various sizes and sensitivities as well as different pressure types, such as absolute and gauge/gage. We offer pressure-sensor packages that are fully …

The XGZP1704 MEMS pressure sensor die offers excellent repeatability, linearity, stability, and sensitivity. Additionally, users can easily calibrate the output, and thermal drift, and perform …

NovaSensor’s P2705 die products utilize four piezoresistors combined in a Wheatstone bridge circuit. When excited by constant voltage, the P2705 die produces a differential millivolt output …

The NovaSensor P883 Medium and High Pressure MEMS Sensor Die utilizes four piezoresistors combined in Wheatstone bridge circuit. When excited by either constant voltage or constant …

Merit Sensor's S Series MEMS die has very repeatable accuracy when exposed to thermal cycling and great stability over time and temperature.

High precision silicon pressure sense dies from 4kPa up to 40MPa for differential, gage and absolute pressure sensor applications with focus on best accuracy, best long-term stability and …

This paper describes a new die attach technology, which can help attenuate the stresses in the mechanically active portion (part containing the sensor) of the die. The die attach is used to …

Microelectromechanical system (MEMS) pressure sensors have changed the way that system designers and application engineers measure pressure. The simplicity of use, small size, low …