Patterned and unpatterned wafer defect inspection and review systems leverage unique photon and e-beam optical and sensor technologies and Al-driven algorithms to find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer.

KLA has a comprehensive portfolio of defect inspection and review systems for advanced chip manufacturing, including additional Surfscan ® unpatterned wafer inspection systems and broadband plasma optical patterned wafer inspectors.

For 40 years our broadband plasma (BBP) patterned wafer inspectors have been at the forefront of defect discovery for the semiconductor industry. Introduced in 1984, the KLA 2020 was the first automated patterned wafer inspection system for chip production, replacing manual inspection by human operators.

brightfield inspector ensures maximum sensitivity over a broad range of immersion litho materials and defect types. Immersion lithography is a key enabling technology for 65nm and 45nm device patterning.

May 30, 2024 · Our broadband plasma (BBP) patterned wafer inspection systems are the flagship product in our comprehensive inspection portfolio. BBP inspectors use advanced optical and data processing technologies to discover critical defects on …

Jun 26, 2007 · KLA-Tencor (NASDAQ: KLAC) today introduced its latest addition to the 28xx brightfield inspection platform, featuring specialized optical configurations that solve the unique defect detection challenges of sub-55nm memory and sub-45nm logic chip manufacturers.

Using enhanced broadband plasma illumination technologies, such as Super•Pixel™ mode and advanced detection algorithms, the 2965 and 2950 EP inspectors provide the sensitivity required to capture critical defects across a range of process layers, material types and process stacks.

Jul 11, 2005 · KLA-Tencor adapted this technology for use in wafer inspection, creating broadband solid-state time delay integration (TDI) sensors that enable the 2800 Series to provide optimum materials contrast and noise suppression, according to the company.

High-brightness (radiance) lightsources are needed for high speed optical inspection of wafers. A broad range of wavelengths is required for flexibility in optical mode selection. DC-driven electrical arc sources have been traditionally employed for microscope illumination.

Jul 11, 2016 · These systems employ a range of innovative technologies to form a comprehensive wafer inspection solution that enables discovery and control of yield-critical defects at all stages of IC...