SK hynix HBM3, with 1.5x capacity than HBM2E from 12 DRAM die stacked to the same total package height, is fit to power capacity-intensive applications such as AI and HPC. A single …

High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.

Apr 8, 2025 · SK hynix speeds up HBM development: HBM4 in 2025 and HBM4E now coming in 2026; SK hynix says its ultra-next-gen HBM4E in 2026, ready for the world of next-gen AI …

Sep 26, 2024 · SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB 1, the largest …

Jun 27, 2024 · SK Hynix has rolled out a roadmap indicating that the company will continue to dominate production of high-bandwidth memory (HBM) that is indispensable for AI. The lead …

Sep 8, 2022 · When SK hynix became the first in the industry to develop HBM3, its latest HBM (High Bandwidth Memory) product, the company not only took its place in the record books but …

May 2, 2024 · This has made SK hynix the secnd HBM memory vendor in recent months to announce that they've sold out into 2025, following an earlier announcement from Micron …

May 30, 2023 · SK Hynix will be producing HBM3E memory using its 1b nanometer fabrication technology (5th Generation 10nm-class node), which is currently being used to make DDR5 …

Apr 19, 2024 · SK hynix has signed an MOU with TSMC to collectively produce HBM and use advanced packaging technology to boost logic and HBM integration.

Jan 30, 2024 · SK hynix introduced HBM to the market in 2013. The technology’s x-factor is its ability to manage massive data flows at incredible speeds. Unlike conventional chips, HBM …