Our award-winning Silicon Wafer Integrated Fan-out Technology (SWIFT ® /HDFO) technology is designed to provide increased I/O and circuit density within a reduced footprint and profile for …

This article introduces packaging technology platforms developed by Amkor including: 2.5D Through Silicon Via (TSV) interposer, Chip on Substrate (CoS), Chip on Wafer (CoW) and …

To simplify the design of the newest advanced packages, such as high-density fan-out (HDFO) and to address all these other constraints, Amkor has introduced the SmartPackageTM …

Package Assembly Design Kits (PADK) The Technology Bridge Between Chip Design and High-Density Fan Out (HDFO) Design, Manufacturing and Assembly Author Debi Polo

Jun 15, 2023 · Specifically, Amkor Technology’s HDFO is known as the substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT) package providing higher bandwidth die-to-die …

Jun 1, 2021 · These reductions may require ultra-thin package z-height and high-bandwidth bottom and top routing layers. To address these challenges, a new interposer-PoP with High …

May 23, 2024 · What makes now the best time is the intersection of software capabilities and the development of available HDFO-specific PADKs that can work the design process from …

To address these challenges, a new interposer-PoP with High-Density Fan-Out (HDFO) redistribution layer (RDL) routing layer has been designed and demonstrated.

In this paper, different advanced high density Fanout (HDFO) technologies have been developed for chiplets integration in HPC applications. Various FOCoS (FanOut Chip on Substrate) …

Jan 18, 2024 · HDFO allows assembly of more than one chip in one package and mostly fine Cu RDL is used to interconnect the chips. In addition, HDFO can be made in wafer and substrate …