The EVG510 is a highly flexible wafer bonding system and supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows for quick and easy retooling for different wafer sizes and processes.

The EVG501 / EVG510 is a highly flexible wafer bonding system that can handle substrate sizes from single chips to 150 mm (200 mm in case of a 200 mm bond chamber). The EVG501 / EVG510 can handle substrate sizes from pieces to 200 mm.

Apr 10, 2025 · The EVG 510 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for polymer bonding and wafer mounting with WaferBOND, but can also be used for other other types of bonding.

Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions.

EVG 510, wafer bonding system (anodic, direct or adhesive): The EVG510 is an equipment for bonding wafers. The bonding chamber process parameters are: 1) temperature of the pressure plates, 2) tool pressure applied on the stack of wafers, 3) chamber vacuum pressure and, 4) bias voltage applied between the plates.

This manual explains how to operate the EVG 510 equipment to bond a stack of two wafers together, using standard bonding methods such as anodic, direct, or adhesive bonding. Max. tool force 10kN. Max. temperature 550 °C. Chamber vacuum < 1E-04 mbar. Max. voltage (anodic bonding) 1000V. 2. Login on CAE.

The EVG501 / EVG510 can handle substrate sizes from pieces to 200 mm. This tool supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct.

Besides supporting wafer-level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions.

The EVG510 is a highly flexible wafer bonding system that can handle substrate sizes from pieces to 200 mm. This tool supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct.

Mar 20, 2025 · The EVG510 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 100 mm wafers. The new tool supports a variety of bonding processes, such as anodic, eutectic, diffusion, fusion, solder, and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a ...