The EVG301 semi-automated single wafer cleaning system employs one cleaning bowl. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures.

With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG’s wafer alignment and bonding systems to eliminate any particle prior to wafer bonding.

With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding.

The EVG301 employs one cleaning station, which cleans wafers using standard DI-water rinse as well as mega-sonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile …

With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG’s wafer alignment and bonding systems to eliminate any particle prior to wafer bonding.

The EVG301 megasonic wafer cleaning system by EV Group completely removes such particles and enables perfect bonding results.

Mar 2, 2012 · Specifically, the EVG 301 is being leveraged by Tokyo Tech to remove particles from the surfaces of pre-bonded III-V compound semiconductor and silicon-on-insulator (SOI) wafers that are used in the production of optical ICs.

This manual explains how to operate the EVG 301 megasonic DI water cleaner to prepare the surface of wafers before bonding experiments. 2. Login on CAE. Login with your “CMi” …

The EVG 301 is a tool that can clean wafers using 1 MHz modulated DI water to create transient cavities that remove debris while minimizing damage to the surface. The size of samples can range from 2” to 8” wafers. Another functionality of the EVG 301 is to image silicon-based bonds using an IR source and camera.

Mar 1, 2012 · EV Group (EVG) has shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology (Tokyo Tech). The EVG301 has already been installed at Tokyo Tech's Arai-Nishiyama Lab, and is being used in the research and development of advanced optical communication ICs.