Nov 23, 2022 · To solve this challenge, EV Group (EVG) teamed up with Teramount to develop optical microstructures using a simple, reliable and cost-effective wafer-level replication process that enables the production and scaling up of complex structures to high volumes.

May 25, 2022 · EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors, such as …

EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors, such as SiPh and engineered substrates.

Process capability for nano- and microstructures, also for complex shaped structures - in a single step! Helping customers to ramp up their ideas!

May 31, 2022 · EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors, such as …

May 25, 2022 · This first paper describes a novel approach for integrating III-V components on an advanced silicon photonics (SiPh) wafer through micro-transfer printing—enabling the economical and scalable integration of optical gain elements in photonic integrated circuits without modifying the established SiPh flow.

At OFC 2025, HYC will showcase these highly integrated subassemblies for 800G/1.6T, SiPh and Next-generation transceivers. We invite industry partners to visit our booth (#3020) and explore the future of high-speed optical interconnects together.

Economical mass production of SiPh components requires high-speed automated alignment with nanometer accuracies: Probing solutions combine high speed, precision, and sensor technologies to avoid direct contact between probe and wafer, particle formation, or chip damage.

Typical SiPh Engine Packaging Structure PIC EIC Submount LD - Si Wave guide /modulator/ MUX/De-Mux - Grating light coupler - Integrated SiGe PD - TSV /high speed connection - Laser DRV/ PD TIA (65nm) - DSP/PAM4 (16->7nm) - All in one or separated - Embedded , Discrete or remote - WLCSP with hermetic PKG-<1um LD D/A on Sub mount (AuSn)

Sep 26, 2023 · OSATs ASE and Winstek are bracing for a surge in demand for heterogeneous integration, which will necessitate demand for newer technologies such as CoWoS, silicon photonics (SiPh), and CPO in...