With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers.

With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation to pre-bonding and IR-inspection – are combined.

The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool.

Dec 7, 2023 · The EVG®850 NanoCleave™ layer release system enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling.

EVG ® 850 Temporary Bonding System (Figure 3) has been designed to integrate the bonding/debonding steps. The modular design of the system allows inclusion of a coat module, a stack of bake...

The EVG850 TB is a temporary bonding system which is fully automated; achieving the entire temporary bonding process – from temporary adhesive application to baking, alignment and bonding the device wafer to the carrier wafer. With its modular equipment layout, the EVG850 TB can be throughput-optimised according to the specific process.

Dec 11, 2023 · The EVG850 NanoCleave system enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an infrared (IR) laser coupled with specially formulated inorganic release materials in a proven, high-volume-manufacturing (HVM) capable platform.

Jun 18, 2013 · The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process modules combined with integrated FOUP storage system allow true continuous mode of operation with an unprecedented throughput of >40 bonds/debonds per hour.

EVG 850 LT SOI Fusion Wafer Bonder, 8"- Fully-Automatic- Suitable for wafer sizes up to 8"/200mm wafers- Currently configured for 8"/200mm wafers- One Cleaning Module- One Spinner Chuck for 8”/200mm wafers- One DI Water Dispense Line- One Genmark Robot with pre-aligner- One LowTemp Plasma Activation Module- High Freque

The EVG®850 DB is a fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks. The fragile device wafers are always supported either through film frame mounting or through a thin wafer handler.