Scanning Acoustic Microscopy (C-SAM) for the non-destructive internal inspection of Microelectronic Parts: How it Works and Physics Fundamentals.

Scanning Acoustic Microscopy (SAM) uses sound waves to detect and identify internal delamination, voids, material density changes, defects and many other anomalies within devices, assemblies and materials.

The results of C-mode Scanning Acoustic Microscopy (CSAM) images of devices with voids caused by flux residue are shown in Figure 1. Large voids (Figure 2) are due to slow capillary flow...

Nov 5, 2020 · The SAM instrument automatically detects a histogram with a phase often caused by irregularities inside the sample such as delamination, void, or a hole. The ultrasonic wave propagation in the acoustic microscope results in the wave front snapshots calculated along the time-of-flight of the echo.

Reflective microscopy looks for voiding at a certain interface. Through-scan microscopy detects voids at any depth in the device. At MuAnalysis, on-site physical and failure analysis supports further investigation if required. MuAnalysis is an authorized distributor of the Hitachi Fine SAT V acoustic tomograph. Come try it.

The results of C-mode Scanning Acoustic Microscopy (CSAM) images of devices with voids caused by flux residue are shown in Figure 1. Flux residue usually has a different surface energy than the...

Jun 11, 2019 · Scanning acoustic microscopy, or SAM, is a non-destructive technique used in failure analysis of complex devices. SAM can provide a resolution down to sub-micron thicknesses. SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer.

Jun 2, 2023 · In this paper, we propose a rule-based method for the classification of the defects and automatic segmentation of the defects to extract precise measurements depending on the type of defect. The classes of defects are precisely defined based on their origin in the process.

May 1, 1998 · Acoustical microscopy, C-SAM in particular, is the preferred method for inspection of solder die attach in power packages. While X-ray may work well for void detection in normal IC packaging, its application in power packing is severely …

CSAM Inspection C-Mode Scanning Acoustic Microscopy (CSAM, also referred to acoustic microscopy, AMI, SAM, and ultrasonic testing (UT)) is a technique that utilizes high frequency ultrasound in pulse/echo and through transmission modes to non-destructively inspect components for cracks, delamination, discontinuities, and a wide range of other ...