Engineered to meet your packaging needs, the 3Ge is an encapsulation innovation that is smart factory ready. Inheriting all the advantages of IDEALmold 3G, the 3Ge boasts greater performance of a 30% faster conversion time, improved mechanical module design and a power-saving pre-heater module.

‌ASMPT laminator IDEALmold™ 3G is an advanced automatic molding system, especially suitable for processing strip and roll substrates. The system has the following main features and functions: ‌Processing range‌: IDEALmold™ 3G can process lead frame substrates with a maximum size of 100mm x 300mm.

Dec 19, 2023 · IDEALmold™ 3G Automatic Encapsulation Solution (strip / reel form substrate handling) Feature Ultra-dense molding solution, the lead frame substrate can handle a range of 100mm x 300mm

From wafer and substrate to surface mount technology (SMT), with AIoT integrated smart factory - SkyEye, ASMPT is committed to providing comprehensive support for future smart automotive. With technological innovation and excellent quality, ASMPT helps promote the rapid development of the smart automotive industry.

By using real-time data and seamless connectivity, ASMPT's intelligent material flow solutions transform intralogistics into a synchronized, efficient and transparent process, ensuring optimal production performance with reduced costs, minimized errors and maximum flexibility.

Sep 9, 2020 · 具有宽带隙（Wide-Band Gap ; WBG）特性的物料，包括SiC和GaN，提供了更优胜的性能： 在高频运行时更少的开关损耗。 由于WBG的特性比以往半导体物料优胜，在不久的将来，SiC和GaN會成为新一代的功率半导体的物料。 然而，新物料的介入令制造商面临各种挑战︰. 1. 晶圆切割工艺：刀片VS雷射切割. 2. 固晶工艺：脆晶和/或薄晶处理. 3. 新工艺： 3A:划胶 - 高银比环氧 (High Silver Epoxy) VS 傳統划胶工藝. 3B: 锡膏處理 (Solder Paste) 3C: 烧结 (Sintering) …

At ASMPT, we are committed to advancing the electronics and semiconductor manufacturing industry through intelligent, customer-focused innovation.

ASMPT's intelligent material flow solutions leverage real-time data and seamless connectivity to optimize intralogistics, enhancing efficiency, reducing costs, and ensuring flexibility for modern electronics manufacturing

3Ge 是為智慧工廠做好準備的封裝創新解決方案，旨在滿足您的封裝需求。3Ge 繼承了 IDEALmold 3G 的所有優點，並擁有轉換時間提升 30% 的更高性能、改進的機械模組設計和節能的預熱器模組。配有預測性維護軟體，可增強自動化程度，減少手動工作。

It highlights key milestones for both SMT Solutions and SEMI Solutions and highlights ASMPT's future strategy, including the integration of artificial intelligence into manufacturing processes...