It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips. Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide. [citation needed]

Winbond is a total memory IC solution provider, consisting of Code Storage Flash Memory, Mobile DRAM, Specialty DRAM, and TrustME Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and …

Winbond's W25X and W25Q SpiFlash ® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512K-bit to 512M-bit, small erasable sectors and the industry's highest performance.

Achieving outstanding cost-effectiveness, the CUBE IO boosts an impressive data rate of up to 2Gbps with total 1K IO. When paired with legacy foundry processes like 28nm/22nm SoC, CUBE unleashes ultra-high bandwidth capabilities, reaching an astounding 32GBs-256GB/s (=HBM2 Bandwidth), equivalent to harnessing the power of 4-32pcs*LP-DDR4x ...

Oct 11, 2023 · Winbond says the CUBE IO boosts a data rate of up to 2Gbps with a total 1K IO. When paired with legacy foundry processes like 28nm/22nm SoC, its bandwidth capabilities reach 32GBs-256GB/s. Winbond is also engaging with partner companies to establish the 3DCaaS platform to leverage CUBE’s capabilities.

Sep 27, 2023 · Cost-Effective Solution with High Bandwidth: Achieving outstanding cost-effectiveness, the CUBE IO boosts an impressive data rate of up to 2 Gbps with total 1K IO. When paired with legacy foundry processes like 28 nm/22 nm SoC, CUBE unleashes ultra-high bandwidth capabilities, reaching an astounding 32 GBs-256 GB/s (=HBM2 Bandwidth), equivalent ...

Oct 5, 2023 · Winbond Electronics Corporation has introduced groundbreaking technology designed to empower affordable Edge AI computing in mainstream applications. The company's novel ultra-bandwidth architecture, known as CUBE (Customized Ultra-Bandwidth Elements), optimizes memory technology to deliver seamless performance for generative AI tasks in hybrid ...

Sep 28, 2023 · One company that is making significant strides in this area is Winbond Electronics Corporation, a global supplier of semiconductor memory solutions. The company has recently introduced a new...

Sep 27, 2023 · Winbond Electronics Corporation has introduced CUBE, an innovative technology that enables affordable Edge AI computing in mainstream applications, optimizing memory performance for seamless execution of generative AI on hybrid edge/cloud platforms.

Sep 27, 2023 · Cost-Effective Solution with High Bandwidth: Achieving outstanding cost-effectiveness, the CUBE IO boosts an impressive data rate of up to 2Gbps with total 1K IO. When paired with legacy...