Xandex DieMark® Inking technology revolutionized die marking at wafer sort and has set the standard worldwide since 1981. Which DieMark ® Inking System is right for you?

Our die inking systems include electric and pneumatic models and utilize convenient, disposable ink cartridges to streamline and optimize the process of marking defective die during the wafer test process.

DieMark Electric Inking Systems utilize convenient, disposable DieMark Filament Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.

The SPA Inker is a fully automatic machine for the physical inking of wafer up to 200mm diameter with a subsequent automatic visual inspection of all inkdots and closed-loop reink cycle.

For microelectronic parts, the drop-on-demand technique is relevant as the task of dispensing small structures and adhesive points in the size of one hundred micrometer and smaller is more and more required. This size is comparable to the scale for solder-bumps for bonding semiconductor chips.

One such technique, commonly referred to as die inking, aims to discard devices that are likely to fail, based on their proximity to known failed devices on the wafer. Die inking is traditionally performed manually by visually inspecting each manufactured wafer and thus it …

Feb 16, 2020 · There are a number of ways to test whole silicon wafers in production. In most cases all die on the wafer are tested and this is often referred to as 100% probe, production, final probe, final test and more. The primary modes of identifying bad …

Hylax Technology wafer marker system integrated with the proprietary technology Scanvision pushes the marking technology to the next level of accuracy even with sawn wafers.

100 % Quality assurance of inking process – comparison with stored wafer maps from host – detection of uninked dies – detection of small/large dots – detection of shifted ink pattern (first die verification) – Standalone for 6 and 8 inch including handling system – Frame handling/inking version available for 6” and 8”

Oct 31, 2017 · Manual wafer-level die inking is a common procedure for excluding die locations that are likely to be defective. Although this is a more cost-effective process,