The HVG Series Vertical Grinding Machine is designed to grind advanced materials to a high degree of precision in flatness and surface quality, often reducing or eliminating the need for lapping.

Feeding from wafer, waffle pack, tray or tape and reel; Full force control with every Placement at all placement height; Easy to exchange linear flux unit

Automatic loading/unloading method: wafer manipulator is used to ensure thin wafers are transported without damage Wafer thickness: 150um-1000um

The High-Speed Wafer Feeder (HSWF) is the world’s fastest rapid-exchange multi-die feeder. Combined with Universal’s FuzionSC™ Platform, it is the ultimate multi-die solution for heterogeneous integration.

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The High-Speed Wafer Feeder is the world’s fastest rapid-exchange multi-die feeder. Combined with Universal’s FuzionSC™ Platform, it is the ultimate multi-die solution for heterogeneous integration.

Model GNX200BP grinder is a fully-automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station.

Key Words: silicon wafer, high flatness, low-damage grinding, high productivity, ultraprecision grinding, high loop rigidity, air spindle, nanolevel micro feed 1. Introduction The integration of MPUs, memories and other semicon-ductor devices is further accelerated. This requires silicon wafers to be higher in flatness with minimal damage. The

The HVG Series Vertical Wafer Grinding Machine is designed to grind advanced materials to a high degree of precision in flatness and surface quality, often reducing or eliminating the need for lapping.

Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette. Compatible with variety of materials. Realize a low running cost.