Mar 24, 2011 · The proposed modeling and analysis methods for the P/G TSV and chip-PDN are fundamental for estimating the PDN impedances of 3D TSV ICs because they are composed …

Feb 11, 2015 · This paper reports on modeling and analysis of power delivery network (PDN) impedance and switching noise in through silicon via (TSV)-based 3-D integration. PDN is …

Sep 16, 2022 · The P/G TSV array in silicon substrate connects adjacent on-chip PDNs to achieve power delivery. In this paper, bumps are simplified as an extension of the TSV metal. …

Jan 1, 2014 · In this chapter, we treat the power distribution networks (PDNs) in TSV and interposer-based 3D ICs. First, we introduce the composition of the PDNs and the …

Dec 13, 2019 · A backside-PDN configuration contains dense microthrough silicon vias (μTSVs) and power/ground metal stack on the backside of the die. This approach separates the PDN …

models of the PDNs, we estimate and analyze the PDN impedance in TSV and interposer-based 3D ICs in the frequency domain with respect to the variations in the main design issues for the …

In this paper, we propose models for large-sized silicon interposer power distribution networks (PDNs) and through silicon via (TSV)-based stacked grid-type PDNs using a segmentation …

Oct 1, 2017 · Power supply noise in three-dimensional integrated circuits (3-D ICs) considering scaled CMOS and through silicon via (TSV) technologies is the focus of this paper. A TSV and …

This paper focuses on the modeling and analysis of different power distribution network (PDN) structures in 3D TSV ICs, including 3D full wave model and equival

Apr 1, 2015 · This paper reports on modeling and analysis of power delivery network (PDN) impedance and switching noise in through silicon via (TSV)-based 3-D integration. PDN is …