IC Packaging SPIL provides comprehensive packaging, offering lead frame base and substrate base packages, with either wire bond or flip chip interconnections. These packages satisfy most applications for customers serving the PC, hand-held product, consumer product and wire communication markets.

Our dedication to enhancing quality and developing technical innovations to satisfy customers' needs has made SPIL one of the top leaders in creating high value-added solutions, to the point where we are now the world class IC packaging and testing services provider.

Siliconware Precision Industries as founded in 1984. In 2000 the company became a public company in NASDAQ and in the same year, SPIL merged with Siliconware Corporation.

SPIL provides services and support to fabless design houses, integrated device manufacturers and wafer foundries globally. We constantly upgrade our processes to meet the demand for the most advanced manufacturing technology and also build a strong reputation for high quality products and services.

Nov 27, 2017 · 【台北=伊原健作】半導体封止・検査の世界最大手、日月光半導体製造（ASE）と同業の （いしへんに夕）品精密工業（SPIL）の経営統合が、2018年5 ...

Jun 1, 2015 · Siliconware Precision Industries Co., Ltd. (“SPIL”) is a leading provider of comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all of its customer’s integrated circuit packaging and testing requirements, with turnkey solutions that range from wafer bumping, wafer probe and sort, package assembly, final ...

Salam Pacific Indonesia Lines (SPIL) is the prominent container liner in Indonesia. Now, we are moving into digital era and transforming to strongly uphold our motto of SPIL Connecting …

Fine Pitch WB Molding Antenna in Package (AiP) About SPIL 關於我們 關於我們 公司簡介

Silicon Precision Industries is a global leader in semiconductor manufacturing solutions. We are dedicated to providing high-quality, innovative process technologies and semiconductor manufacturing equipment to meet the needs of customers in various application fields. Our product range covers wafer fabrication, packaging testing, and advanced packaging …

SPIL's superior achievements in Reseach and Development have resulted in new technologies that will be utilized to meet future packaging demands.