Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.

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Jul 6, 2016 · FOWLP provides electrical connections with physical protection to silicon semiconductor integrated circuit (IC) chips, allowing circuit traces to be reliably routed for connection outside the die.

Mar 26, 2020 · FOWLP offers multiple advantages over conventional packaging technologies: Shorter interconnect paths lead to fewer parasitics and less delay. Shorter paths to heatsinks reduce concerns about *thermal impacts and resistance. Lower power consumption. Option to place even more components vertically, reducing footprint.

Whereas conventional circuits built on silicon can withstand heat up to 400oC and can be degassed in under one minute, the EMC and dielectrics used in FOWLP have a heat tolerance closer to 120oC. Temperatures exceeding this low threshold can cause decompo- sition and excessive wafer warping.

Embedded silicon fan-out (eSiFO®) technology developed by Huatian group was a low cost FOWLP technology, which eliminates molding, temporary bonding and de-bonding in the process flow....

Fan out wafer level package (FOWLP) is a new type of wafer level package with fan out capabilities. FOWLP allows spreading the wafer bumps across a substrate which is applied to the wafer. The substrate is essentially bigger than the die therefore the die spacing is more relaxed.

Whereas conventional circuits built on silicon can withstand heat up to 400oC and can be degassed in under one minute, the EMC and dielectrics used in FOWLP have a heat tolerance closer to 120oC. Temper-atures exceeding this low threshold can cause decompo-sition and excessive wafer warping.

This technology has begun to eclipse conventional Fan-Out Wafer-Level Packaging (FOWLP) because it leverages the larger substrate area of panels, allowing for increased I/O density, which is critical in supporting the growing complexity of semiconductor devices.

Oct 10, 2022 · WHAT IS THE MAIN MOTIVATION FOR FOPLP INSTEAD OF FOWLP? Advantageous for high volumes and large package sizes. Flexibility in the manufacturing flow. Capability for panel manufacturers (PCB/substrate suppliers) to use existent equipment and panel handling experience.