Defines an outline environment, which allows outline-style indented lists with freely mixed levels up to four levels deep. It replaces the nested begin / end pairs by different item tags \1 to \4 for each nesting level.

Package images below are for general reference only. If you require higher quality versions of the images below, please contact marketing. For detailed image specifications see package …

A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.

In this article we present world organisations for publishing IC (Integrated Circuit) and discrete semiconductor package outlines standards. These organisations publish many standards but our focus is on package outline types and their dimensions. List of organisations are:

Aug 23, 2002 · The package defines an outline environment, which provides facilities similar to enumerate, but up to 6 levels deep.

IC Package Outlines Click on the image of the package family of interest for dimensioned drawings of common pin counts. For detailed PCB layout drawings click here to go to the Semiconductor Vendor Links page on RF Cafe. See table of …

JEDEC Standard 95-1, hereinafter known as the DESIGN HANDBOOK, will establish guideline methods for obtaining the desired dimensions and tolerancing for various classes of packages and related items. This Handbook will be updated on a …

List of Diodes' packaging materials, including outlines and specifications for BCD, carton, label, SMD, and through-hole product packaging.

TO packages are known for their distinctive metal can shape, which provides thermal and mechanical benefits. Here are some key features and common variations of TO transistor …

Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of course, cost.