Sep 27, 2020 · Polyimide (PI) and Polybenzoxazole (PBO) products are typically used as a stress relief and protective insulating layer before packaging or redistribution layer (RDL). PI and …

Dec 1, 2019 · A number of prestigious material companies including Siemens, Dow Chemical, and Toray Industries took the odyssey and their R&D work led to photosensitive negative-tone …

Apr 24, 2017 · A key enabler in the fan-out package is the polymer redistribution layer (RDL) or sometimes referred to as the dielectric layer. There are several types of polymers used as …

In this process, a stress relieving layer of either Benzocyclobutene (BCB) or Spheron™ (an FCI proprietary high performance dielectric repassivation layer) is deposited on the die before …

PBO/PI provides for better electrical isolation than BCB because it will reside on top of the first dielectric layer and BCB must be anchored on the native passivation

Jan 1, 2017 · In this paper, we will report on our novel low temperature (<200C) curable PBO and PI. A novel alkaline positive tone PBO was developed by re-designing key components of the …

Dec 12, 2024 · After the introduction of the P (S- co -BCB- co - pre PBO), a coating layer forms on the surface of PBO fibers, enhancing their surface activity, thereby reducing the contact angles …

Feb 1, 2021 · In this work, random copolymers (P (S- co -BCB- co- MMA)) containing benzocyclobutene in the side-chain were synthesized by reversible addition-fragmentation …

Nov 19, 2016 · Electronic packaging and assembly is the basic technology to link the small dimensions of the IC to an interconnecting substrate—usually the printed circuit board/printed …

There are a wide variety of polymeric materials available to packaging manufacturers: PI, PBO, BCB, epoxies, silicones, and acrylic, all of which are defined by their constant dielectric, cure …