Heat sink paste to protect sensitive electronic components against overheating. For optimum effect, carefully clean the contact point, e.g. with OKS 2610/OKS 2611 universal cleaner. Apply evenly and thinly to the functional surfaces with a brush, spatula, etc. Avoid excesses.

Heat protection of sensitive components, e.g. sensors, probes, measuring instruments and semiconductors, diodes, transistors and thyristors mounted on cooling plates or metal housings. Highly effective due to high heat conductivity. Neutral behaviour toward materials used. Consistent properties without drying out, hardening or bleeding.

Protection of sensitive components, such as sensors, probes and measuring instruments, or semiconductors, such as diodes, transistors and thyristors, by reinforcing the thermal coupling …

Protection of sensitive components, such as sensors, probes and measuring instruments, or semiconductors, such as diodes, transistors and thyristors, by reinforcing the thermal coupling …

Heat sink paste to protect sensitive electronic components against overheating. For optimum effect, carefully clean the contact point, e.g. with OKS 2610/OKS 2611 universal cleaner. Apply evenly and thinly to the functional surfaces with a brush, spatula, etc. Avoid excesses.

Wärmeleitpaste zum Schutz empfindlicher elektronischer Bauteile vor Überhitzung. Für optimale Wirkung Kontaktstelle sorgfältig reinigen, z.B. mit OKS 2610/OKS 2611 Universalreiniger. Mit Pinsel, Spachtel, etc. gleichmäßig dünn auf die Funktionsflächen auftragen. …

Heat sink paste to protect sensitive electronic components against overheating.

Protect sensitive components, such as sensors, probes, measuring instruments or semiconductors, such as diodes, transistors, and thyristors, with this paste by improving heat linking to cooling plates or metal housings. It's especially useful when using Peltier elements.

Protegge componenti elettronici sensibili dal surriscaldamento. Alta conducibilità termica, 20 volte maggiore di quella dell’aria. Elettricamente isolante. Assenza di essiccazione, indurimento e gocciolamento. Per l’accoppiamento di componenti elettronici, ad esempio sensori, sonde, diodi, transistor, a lamierini di raffreddamento.

Heat sink paste to protect sensitive electronic components against overheating. For optimum effect, carefully clean the contact point, e.g. with OKS 2610/OKS 2611 universal cleaner. Apply evenly and thinly to the functional surfaces with a brush, spatula, etc. Avoid excesses.