In recognition of the varying degrees of popcorn cracking tendency of various package types, IPC/JEDEC defined a standard classification of moisture sensitivity levels (MSL's). The MSL's are expressed in numbers, with the MSL number increasing with the vulnerability of the package to popcorn cracking.

MSL ratings of PCBs are dependent on material, manufacturing process, construction and design. As indicated in this study, some PCBs may indeed be capable of an MSL 2 or possibly an MSL 1 rating.

IPC/JEDEC J-STD-020 defines the Moisture Sensitivity Levels (MSL) of surface mount devices. Moisture-sensitive devices are baked and vacuum-sealed inside a moisture barrier bag prior to shipment in order to minimize their tendency to exhibit popcorn cracking during board mounting.

Moisture sensitivity level (MSL) relates to the packaging and handling precautions for some semiconductors and is a rating that shows a device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering as defined in J-STD-020.

IPC/JEDEC J-STD-033 is the electronics industry standard for handling, packing, shipping and use of Moisture, Reflow and Process sensitive devices. This standard includes a factory floor life table at 30°C dependant on the component MSL rating, as shown in Table 1. Table 1. Factory Floor Life @ 30°C.

Moisture Sensitivity Level (MSL) is a standard defined by IPC/JEDEC J-STD-020 that indicates how susceptible a moisture/reflow-sensitive electronic component is to moisture-induced stress during storage, handling, and the PCB assembly process.

The Moisture Sensitivity Level (MSL) rating indicates the sensitivity of electronic components to moisture during the solder reflow process. It typically ranges from MSL 1 to MSL 6 and is specified by the component manufacturer in the datasheet.

The table below presents the MSL definitions per IPC/JEDEC's standard. Also refer to the “Moisture Sensitivity Caution Label” on the packing material, which contains information about the moisture sensitivity level of Freescale products.

Dec 18, 2023 · SMD components can be sensitive to moisture. Learn about the MSL levels and recommendations of the IPC/JEDEC J-STD-033 standard. SMT reflow soldering is a process in which SMD component packages are heated to temperatures above 200°C.

The classification of moisture sensitive components is outlined in the IPC specification J-STD-20. Below is a basic chart which defines moisture exposures applicable to Surface Mount Device (SMD) packages.