LOCTITE ® EA 608 is a clear, 2-part, fast-setting epoxy adhesive used in many applications where optical clarity and/or fast cure rates are needed. It bonds a variety of materials, including metals and plastics.

Loctite Hysol 608 clear two-part epoxy adhesive is compatible with metal and plastic materials with a 24 hr cure time. Provides a 5 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2980 psi. Comes in a 2.8 oz Kit. This epoxy adhesive is packaged 50 ml per inner, 10 per case.

LOCTITE Epoxy Adhesive: 608, Heat Cured… Roll over image to zoom. Ready-to-mix epoxy adhesives come in tubes, bottles, or cans, one container for the resin and one for the hardener. Once dispensed and mixed, they can be resealed for reuse. Looking for LOCTITE, 608, Epoxy Adhesive? Find it at Grainger.com®.

Henkel Loctite EA 608 is a two component, medium viscosity, high strength, fast setting epoxy adhesive that cures at room temperature. 50 mL Cartridge. Used to bond a variety of materials including metals and plastics where optical clarity and fast cure rates are needed.

Loctite EA 608 is a clear, fast setting epoxy adhesive used in many applications where optical clarity and/or fast cure rates are needed. Loctite EA 608 bonds a variety of materials including metals and plastics.

Loctite EA 608 is a clear, fast setting epoxy adhesive used in many applications where optical clarity and/or fast cure rates are needed. Download the Loctite EA 608 technical data sheet (TDS) and the Loctite EA 608 safety data sheet (SDS) from Silmid today.

LOCTITE® EA 608 is a clear, 2-part, fast setting epoxy adhesive used in many applications where optical clarity and/or fast cure rates are needed. It bonds a variety of materials including metals and plastics.

Henkel Loctite 608 Hysol Epoxy Adhesive delivers strength and unbeatable performance in one compact package. The high-strength epoxy additive is a fast setting, medium-viscosity, low-odor multiple-surface structural adhesive that cures at room temperature and forms a clear bondline.