
Huawei Y7p - Full phone specifications - GSMArena.com
Huawei Y7p Android smartphone. Announced Feb 2020. Features 6.39″ display, Kirin 710F chipset, 4000 mAh battery, 64 GB storage, 4 GB RAM.
Huawei Y9 Prime (2019) - Full phone specifications - GSMArena.com
Huawei Y9 Prime (2019) Android smartphone. Announced Aug 2019. Features 6.59″ display, Kirin 710F chipset, 4000 mAh battery, 128 GB storage, 4 GB RAM.
HiSilicon Kirin 710F: specs and benchmarks - NanoReview
HiSilicon Kirin 710F – an 8-core chipset that was announced on January 1, 2019, and is manufactured using a 12-nanometer process technology. It has 4 cores Cortex-A73 at 2200 …
HiSilicon Kirin 710F : Detailed Specifications and Benchmark Tests
HiSilicon Kirin 710F This is a processor manufactured using the TSMC 12nm process, announced on Jan 2019. It features 8 cores, operates at a frequency of 2200MHz, and integrates the Mali …
List of Huawei products - Wikipedia
11 hours ago · Huawei G9 Plus (2016, the Chinese version of Huawei Nova Plus) Huawei GR3 (2016, Huawei Enjoy 5S in China) ... Kirin 710F 64/128 GB 4 GB 16 MP (wide) 8 MP …
HiSilicon Kirin 710F - GadgetVersus
Technical specifications and performance with the benchmarks of the HiSilicon Kirin 710F processor dedicated to the smartphone sector, it has 8 cores, 8 threads, a maximum …
Huawei HiSilicon Kirin 710F: Benchmark Performance and Specs
Huawei HiSilicon Kirin 710F Performance Review: Detailed Specs, Benchmark Scores Including AnTuTu & Geekbench, and In-Game FPS Results. See How It Compares With Equivalent …
hisilicon kirin 710f (12 nm) all phones (list) - PhonesData
The most comprehensive list of smartphones that use the chipset hisilicon kirin 710f (12 nm).
HiSilicon Kirin 710F specs - Chip Guider
HiSilicon Kirin 710F mid-range processor designed for installation in mobile gadgets such as phones and tablets, announced in 2018. The CPU produced by a 12 nm process. The chipset …
HiSilicon Kirin 710F Specs, Features and performance score in
HiSilicon Kirin 710F – an 8-core chipset that was announced on January 1, 2019, and is manufactured using a 12-nanometer process technology. It has 4 cores Cortex-A73 at 2200 …