The Synopsys HBM3 PHY is a complete physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking ASIC, ASSP, and system-on-chip (SoC) applications requiring high-bandwidth HBM3 DRAM interfaces operating at …

High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.

Dec 1, 2023 · Cadence PHY IP for High-Bandwidth Memory (HBM) is leading the way with high-performance 3D-stacked DRAM system-in-package (SiP) development. Cadence’s HBM PHY IP is part of the comprehensive Cadence Design IP portfolio comprised of interface, memory, analog, and systems and peripherals IP.

HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor

The Cadence High-Bandwidth Memory generation 3 (HBM3) PHY is optimized for systems that require the highest-bandwidth, low-latency memory solution. The memory subsystem PHY supports data rates up to 8.4Gbps per data pin, featuring 16 independent channels, for a total data width of 1024 bits.

Dec 1, 2023 · The Cadence High-Bandwidth Memory generation 2/2E PHY (HBM2E/2 PHY) is silicon-proven and is available in four process nodes: PHYs, achieving breakthrough performance, low energy per bit, and low area relative to the data bandwidth.

Designed for systems that require low latency and high bandwidth memory, the Rambus HBM2 PHY, built on the GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology, is targeted at networking and data center applications.

The MidasCORE High-Bandwidth Memory Generation 3 (HBM3) PHY is ideal for applications involving graphics, high-performance computing, high-end networking, and communications that require very high memory bandwidth, lower latency, and more density.

Feb 10, 2017 · Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology, is targeted at networking and data center applications.

High Bandwidth Memory 3 (HBM3) is a memory standard (JESD238) for 3D stacked synchronous dynamic random-access memory (SDRAM) released by JEDEC in January 2022, offering significant improvements over the previous HBM2E standard (JESD235D).