A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of EPO …

Product Description: EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly …

It is a lower viscosity version of EPO-TEK® H61. Typical Properties: Cure condition: 150°C / 1 Hour Different batches, conditions & applications yield differing results. Data below is not …

View and Download Intel H61 user manual online. Intel H61 Express Chipset Based M/B for Intel Core Processor Family. H61 motherboard pdf manual download. Also for: G03-nmf92-f.

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EPO-TEK® H61 Advice on general occupational hygiene Do not eat, drink or smoke when using this product. Wash promptly with soap and water if skin becomes contaminated. Wash after …

Jun 14, 2013 · MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL …

Thermally Conductive Epoxy EPO-TEK® H61 Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These …

Designed for scalability and cost optimization platforms, the Intel H61 Express Chipset enables 1 DIMM per channel of DDR3 1333 MHz. With Intel® Turbo Boost Technology 2.01, 2nd …

Product Information Sheet EPO-TEK® H61ND This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) …