EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for …

The EVG540 system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D …

EVG has over 30 years’ experience in building wafer bonders and the GEMINI system stands out as the global industry standard for permanent wafer bonding in high-volume manufacturing.

EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for …

The EVG520 IS is well suited for small-volume-production applications. Redesign based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS …

The EVG510 is a highly flexible wafer bonding system and supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The …

Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as …

Fusion or direct wafer bonding allows dielectric layers and more precisely activated dangling of functional groups to bridge between wafers with the help of hydrogen bridge bonds. This pre …

The EVG560 automated wafer bonding system is a highly configurable production bonder. Based on the same bond chamber design and incorporating the key features of EVG's manual …