The EVG®850 DB is a fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks. The fragile device wafers are always supported either …

EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as …

EVG BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches …

GEMINI FB XT meets critical wafer-to-wafer alignment and productivity requirements for high-volume manufacturing; reinforces EVG’s leadership in fusion and hybrid bonding.

The EVG-3D panels consists of a three-dimensional welded wire space frame fitted with an expanded polystyrene insulation core. The EVG-3D Construction System is a well-proven …

EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as …

The EVG bond alignment systems are qualified throughout production environments and offer the highest precision, flexibility and ease of use, and modular upgrade capability.

FLORIAN, Austria, June 30, 2014 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today …

EV Group (EVG) is a supplier of wafer processing solutions for the semiconductor, MEMS and nanotechnology industry. Key products include manual and fully automated lithography …

Temporary bonding is an essential process that ofers mechanical support for thin or to-be-thinned wafers, which is important for 3D ICs, power devices and FoWLP wafers as well as for …