Effective 3D stacking of DRAM devices can offer many benefits; improved performance, increased component density and greater surface area utilization.

Abstract: A cost-minimized generation-spanning double die DRAM packaging (DDP) technology suitable for making ultra-high performance high-capacity server DIMMs for both the DDR3 and DDR4 DRAM generations was developed. Using existing wirebond-based manufacturing infrastructure it is immediately deployable with no new assembly equipment required.

DDR4 SDRAMs are very prevalent in devices that use ASICs and FPGAs. In this tutorial we explore the basics of DDR4 memory starting with what it looks on the inside, how basic operations such as READ and WRITE work, DRAM page size, ranks and addressing.

Apr 3, 2019 · This article explains which form of DRAM memory is best for your SoC application, comparing DDR variants, types of DIMM, mobile and low-power versions, graphics memory and 3D stacks.

DRAM Packaging Terminology • Number of identical die in package: 1=SDP, 2=DDP, 3=3DP, 4=QDP • FBGA BOC – Board On Chip For SDPs • FBGA COB – Chip on Board For DDP+ • Stacking Technologies: RDL – Re-Distribution Layer, routes edge to center of die 2-4 COB – Bondwire (BW) to each die edge, RDL to center

DRAM : 4 Revision # of Internal Banks Bit Organization Density DRAM Type DRAM SAMSUNG Memory Interface (VDD, VDDQ) Package Type ... DDP) 2: FBGA (Halogen-free & Lead-free, 2H TSV) 3: FBGA (Halogen-free & Lead-free, 2H 3DS) 4: FBGA (Halogen-free & Lead-free, 4H TSV) 5: FBGA (Halogen-free & Lead-free, 4H 3DS) 11. Speed K 4 A X X X X X X X - X X X X

Cheaper than conventional DRAM packaging o xFD: lowest assembly cost per DRAM die for single, double and quad die packages • Simplified process flow: fewer process steps • Minimal gold usage • No expensive redistribution layer process (RDL) • …

Multiple DRAM dies are often packaged together to increase the density of standard DRAMs. Typically, individual DRAM dies are packaged as dual-die (DDP) or quad-die (QDP) packages to support 2 or 4 memory ranks respectively in the DRAM package.

Mar 1, 2012 · A cost-minimized generation-spanning double die DRAM packaging (DDP) technology suitable for making ultra-high performance high-capacity server DIMMs for both the DDR3 and DDR4 DRAM...

A performance-enhanced cost-reduced double die DRAM package was developed The package features a streamlined manufacturing flow and is the lowest cost way to assemble a given number of DRAM die