Aug 11, 2021 · In this article, you will learn important decoupling capacitor placement strategies to have an efficient power distribution network (PDN) and I/O signals. The separation of AC and DC signals is vital for PCB assemblies or else it will impact both signal integrity and power integrity.

When the pitch is 0.8/0.5 mm. the decaps should be placed at the bottom of the BGA and then route them through a via on pad as through hole vias will not be fit the gap between the balls of BGA.

Much research has been done on decoupling capacitor selection and placement for BGAs. This application report provides the current best practices, and what TI recommends in general for placement and selection of values. In the past, TI (and many other semiconductor companies) recommended 1 capacitor (cap) per power pin.

MCM, BGA, flip-chip, to name a few; in addition to ever more demanding analytical methods, ASAP-1’s application array has been expanded to enable mechanical decapsulation and topside de-processing. The latest ASAP-1 models provide the same intelligent engineering approach and intuitive user interface, whilst incorporating advanced optical sample

Chemical Decapsulation (Decap) is the creation of a cavity on the package surface of an electronic component such as a DIP, BGA, QFN or other types of packages to expose the die underneath for inspection.

Apr 4, 2016 · In this work we explain detailed how we successfully decapsulated a state of the art FPGA realized in a 45 nm technology and packaged in a BGA housing [1]. The challenge here is the BGA...

In this paper we explain detailed how we successfully decap-sulated a state of the art FPGA realized in a 45 nm technology and packaged in a BGA housing. For running SCA attacks it is important that the IC is still fully functional after decapsulation.

Decap即开封，也称开盖，开帽，指给完整封装的IC做局部腐蚀，使得IC可以暴露出来，同时保持芯片功能的完整无损, 保持 die, bond pads, bond wires乃至lead不受损伤, 为下一步芯片失效分析实验做准备，方便观察或做其他测试（如FIB,EMMI），Decap后功能正常。

Mar 7, 2019 · Safely decapsulate any BGA with the JetEtch Pro. Using a high-temperature sulfuric acid etch, we safely etched this BGA sample with no solder ball damage.

芯片开封decap介绍： Decap 即开封，也称开盖，开帽，指给完整封装的IC做局部腐蚀，使得IC可以暴露出来，同时保持芯片功能的完整无损，保持 die，bond pads，bond wires乃至lead-frame不受损伤，为下一步芯片失效分析实验做准备，方便观察或做其他测试（如FIB，EMMI ...