DDR5 brings more than doubled increase in performance compared to DDR4, with double the burst length from 8 to 16, and double the banks from 16 to 32. The astonishing performance raises the ceiling on big data processing, while seamlessly handling 8K content.

Samsung’s DDR5 module boasts transfer speeds of up to 7,200 Mbps, enabling it to more effectively handle the ever-increasing demands of larger and more complex data workloads like those of hyperscale data centers.

Going beyond the performance limitations of existing DRAMs, DDR5 will be pivotal in leading data-driven innovation in terms of speed, capacity, and eco-friendliness. In order to learn more about the new world DDR5 is helping to build, take a look at the video below.

That’s exactly what Samsung’s new DDR5 module with its HKMG process technology is designed to deliver. Samsung’s DDR5 memory gives power users the high-capacity, energy-efficient memory modules they need to hit the best possible balance between performance and efficiency.

DDR5 provides next-level speed, capacity, reliability, and power savings optimal for exponential data growth. This memory innovation opens new possibilities for industry advancement and better life experiences.

DDR5 increases burst length to BL16, about double that of DDR4, improving command/address and data bus efficiency. The same read or write transaction now provides twice as much data on the data bus while limiting the exposure to IO/array timing constraints within the same bank.

A new level of speed, improved capacity, and bolstered reliability are packed into DDR5 to enhance overall system performance. Samsung's memory technology propels the next era of planet-friendly innovation with power-saving DDR5.

Samsung’s development of the 1z-nm DRAM paves the way for an accelerated global IT transition to next-generation DRAM interfaces such as DDR5, LPDDR5 and GDDR6 that will power a wave of future digital innovation.

To respond to the Hyperscale AI market, Samsung is bringing a variety of memory portfolios based on application-specific requirements to market, such as DDR5 1, HBM 2 and CMM 3. All of these solutions will power the wide range of upcoming AI technologies.

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