The QFN devices commonly known as BTC (bottom terminated components) are attractive due to their low cost per I/O, performance and low profile; they are also a challenge for assembly due to their low to zero standoff height.

Quad-flat no-leads (QFNs) packages are one of the fastest growing package excluding flip-chip chip scale [1]. The advantages and disadvantages offered by QFNs are well understood. Benefits include reduced lead inductance, small footprint, thin and light-weight with good thermal and electrical properties [2].

Explore design and process optimization for Dual Row QFN packages. Challenges, solutions, leadframe design, and solder joint reliability.

In additional to simulation, experiments of shadow moire and C-Mode Scanning Acoustic Microscopy (C-SAM) were conducted to collect data on the warpage and air traps of QFN packages which was then correlated with simulation data.

Sep 1, 2017 · This study focuses on the impact of mold cap thickness on strip warpage of a molded Quad Flat No Lead (QFN) package to provide guidance in reducing the strip warpage to an acceptable level.

Quad Flat No Lead (QFN) is part of an integrated circuit (IC) products that required wire bonding and molding as part of its packaging process. There are many types of QFN packages...

Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages.

Abstract: This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varied substrate metallizations subjected to thermal cycling.

Visual inspection and acoustic microscope inspection (CSAM) was performed before and after moisture soak and reflow per MSL1 levels specified by IPC/JEDEC J-STD-020E. No degradation in product performance was seen.

CSAM before and after: Required (Note 3 and Note 4) TEST @ R 7/720 Qual By Similarity to Chablis Pass 1.6 Pin 24(Vout) shorted to ground due to test ... 15 1 15 0/15 Generic data from other QFN packages. PD JESD22-B100 Physical Dimensions(PD): PD per FSL 98A drawing Cpk = or > 1.67 10 3 30 0/30 Performed by Assembly Site during qual lot