Panel Plating – Stratus™ P500. ECD 510 x 515 mm Panel Processing. Applications. Configurable for up to 5 metals. Multi-chip Fan Out; SoC packages; MicroLED; Features. Wafer level …

The Stratus™ P500 has been proven to deliver wafer scale plating precision on panels up to 510 x 515 mm at the leading panel makers. This panel scale plating tool is a semiconductor …

ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to …

ASMPT NEXX, Inc. is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to …

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Stratus TM P500 Bumping is an advanced wafer level process technology where “bumps” or “balls” made of various metals are formed on the substrate before the wafer or board is cut, or …

面板电镀 - Stratus™ P500. ECD 510 x 515 mm 面板加工. 应用. 可配置多达 5 种不同的电镀材料; 多晶扇出; SoC 封装; MicroLED; 特点. 晶圆级精度硬件和软件; Cu、Sn(Ag)、Ni 和 Au 电镀 …

ASMPT-NEXX 'Stratus P500' Panel ECD ECD 514~516mm (Standard) Panel Processing Applications Configurable for up to 5 metals. Bid on ASMPT-NEXX 'Stratus P500' Panel ECD …

ASMPT NEXX, Inc. #P500 #CapitalEquipment Electro Chemical Deposition (#ECD) Tools are ready to advance the future of packaging, whether copper deposition for the latest generation …

Der Stratus™ P500 hat sich bei den führenden Plattenherstellern bewährt und liefert präzise Beschichtungen auf Waferebene für Platten bis zu 510 x 515 mm. Dieses …