ASMPT CIS Total Solution covers every aspect of the CMOS Image Sensor packaging process including die bonding, wire bonding, cleaning, AOI, lens attachment, active alignment, and testing. Industry-Recognized Market Leader

Our inline solutions deliver high performance, optimizing production efficiency and ensuring a better cost of ownership. We are committed to meeting the requirements of the AIoT era, offering seamless integration and material traceability. By implementing rigorous cleanliness control measures, we ensure high-quality output and minimize defects.

ASMPT Smart COB Inline is a comprehensive chip-on-board (COB) inline solution specifically designed for packaging CMOS image sensors. It offers intelligent inline capabilities that are highly suitable for a wide range of applications, including smartphone cameras, AR/VR devices, security cameras, 3D sensing, medical cameras, and automotive cameras.

CIS-InLine 是一套处理 CMOS 图像传感器的智能联机系统，适用于广泛的产品。 本联机系统为您提供最精确的解决方案，结合其创新的主动式镜座对位解决方案的经验，以最低的拥有成本和最高的生产率实现最佳光学性能。 ASMPT 了解在联机组装中清洁度的重要性，通过集成 HEPA / ULPA 过滤器和清洁模组的使用来确保生产环境的超高洁净度。

By using real-time data and seamless connectivity, ASMPT's intelligent material flow solutions transform intralogistics into a synchronized, efficient and transparent process, ensuring optimal production performance with reduced costs, minimized errors and maximum flexibility.

ASMPT CIS Automotive is proud that major tier 1 customers have chosen our ACAMLine™ to handle this enormous task. The line is designed for modular machine integration and scalability, with in-depth process of the CIS automotive assembly process.

Mar 20, 2023 · It recently announced its full year 2022 results (https://www.asmpt.com/en/investors/financials-results/), achieving its second highest ever revenue and bookings in spite of a challenging macroeconomic environment …

ASMPT provides you the most precise bonding experience by our innovative active alignment solution. It enables the best optical performance with the lowest cost of ownership and highest …

ASMPT SEMI is the global leader in the semiconductor industry, providing systems and solutions to the majority of the world's leading IDMs, OSATs, Tier 1s and key players in the supply chain. We provide solutions for both advanced packaging and mainstream applications.

ASMPT Smart COB Inline CMOS Image Sensor #CIS Packaging Solution is shaping the future of vehicle cameras. This integrated offering tackles key issues like die bonding, wire bonding, and...