Jul 16, 2024 · The "Granite Ridge" desktop processor is a chiplet-based processor, much like the Ryzen 7000 "Raphael." AMD is confirmed to be reusing the 6 nm client I/O die (cIOD) from "Raphael." This chip measures 122 mm², and packs 3.4 billion transistors.

Oct 8, 2024 · AMD's new Zen 5-powered Ryzen 9000 series 'Granite Ridge' CPUs get some absolutely beautiful high-res die shots, new TSV layout for 3D V-Cache CPUs.

Sep 26, 2022 · We’ll start our look at the Ryzen 7000 silicon with the glue that holds the chip together: the I/O Die (IOD). Whether it’s a 7600X or 7950X – one CPU chiplet or two – every Ryzen 7000 processor...

Feb 18, 2025 · AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package...

Jul 18, 2024 · As it turns out, AMD's 'Eldora' core complex die of the company's Ryzen 9000-series processors packs 8.315 billion transistors, which is significantly more than the Durango Zen 4 CCD, which has...

Mar 5, 2023 · Although we've known most of the details of AMD's I/O die in its Zen 4 processors, until now, AMD hadn't shared a die shot of the cIOD, but thanks to its ISSCC 2023 presentation, we not only have a die shot of the cIOD, but some friendly people on the internet have also made annotations for us mere ...

Mar 6, 2023 · Analysis of a die shot for the Zen 4 cIOD confirms a lot of what we new and reveals some interesting surprises.

Oct 7, 2024 · This design allows for the addition of a 64 MB L3D cache die, which connects to the CCD's ring bus via TSVs, creating a combined 96 MB L3 cache (32 MB on-die and 64 MB 3D V-cache).

Nov 9, 2020 · AMD's Ryzen 5000 Zen 3 Desktop CPU codenamed 'Vermeer' has recieved its first ever high-res die shots which have also been fully detailed.

Oct 7, 2024 · AMD has recently unveiled its highly anticipated Granite Ridge "Zen 5" processor, showcasing significant architectural advancements and high-resolution die shots that reveal the intricate details of its design.