Jun 10, 2013 · ABF has been improved with the progress of IC. reduce the transmission loss... High transmission because of low resistance at the interface. The key of fine line formation is to lower profile (smooth surface) with keeping high peel strength. Fast flash-etching! Good for …

Ajinomoto Build-Up Film® (ABF) is used as an insulating material for high-performance semiconductors (CPUs), which are the heart of personal computers. ABF currently boasts a share of nearly 100% of the market for Insulation film used in major personal computers worldwide.

Insulation Build-up Materials; Ajinomoto Build-up Film(ABF) Low Dielectric Loss ABF for high frequency package Next Generation ABF for Thinner Application

The build-up dielectric for M1-M3 is chosen to be ABF GX92 from Ajinimoto, Japan. Due to poor adhesion of copper to glass, dielectric is added even for the first metal layer.

Oct 1, 2018 · Our insulation build-up materials for a semi-additive process (Ajinomoto Build-up Film, which is abbreviated to “ABF” in this paper) show low dielectric loss tangent, good insulation reliability between thin layers, and smooth resin surface after desmear.

Low Df and Smoother Surface( skin effect ) are the key to achieve lower transmission loss. GL showed good Frequency stability. Fine Line by Semi Additive Process.

We demonstrate the formation of L/S=2/2μm using ABF GX92 with the thin copper transfer film by the process based on silicon wafers. Fig. 5 shows details of the process.

Ablation rates of ABF (GX92 & GX-T61) as a function of fluence. Addressing the latest advanced packaging industry requirements, such as the creation of fine feature sizes (2-5µm) and...

(1) Based on the performed tests on submitted sample(s), the test results of Cadmium, Lead, Mercury, Cr(VI), PBBs, PBDEs, DBP, BBP, DEHP, DIBP comply with the limits as set by RoHS Directive (EU) 2015/863 amending Annex II to Directive 2011/65/EU.

ABF facilitates copper interconnect fabrication through plating. Plating can be applied to ABF by roughing its surface (copper interconnect fabrication through plating). II-6. New printed circuit board manufacturing method. II-7. ABF’s distinguishing attributes.