Ajinomoto Build-Up Film® (ABF) is used as an insulating material for high-performance semiconductors (CPUs), which are the heart of personal computers. ABF currently boasts a share of nearly 100% of the market for Insulation film used in major personal computers worldwide.

Today, ABF is an essential material for forming the circuitry that guides the flow of electrons from nanoscale CPU terminals to the millimeter-scale terminals on printed substrates. The quality of ABF is constantly improving in line with rapid upgrades in CPU performance.

ABF facilitates copper interconnect fabrication through plating. Plating can be applied to ABF by roughing its surface (copper interconnect fabrication through plating). II-6. New printed circuit board manufacturing method. II-7. ABF’s distinguishing attributes.

Mar 26, 2024 · The surface finish of ABF substrates, such as the copper layer, plays a critical role in solderability and long-term performance. Poor surface finishes can cause poor wetting during soldering, leading to weak electrical connections or premature failure.

Low Dielectric Loss ABF for high frequency package Next Generation ABF for Thinner Application 3. Molding Film(ABF-LE) Over View of the Ajinomoto Group (as of March 31, 2017) Foundation Paid-in Capital Net sales FY2017 May 20, 1909 JPY 79,863million Number of employee 34,452 JPY 1,150.2 billion

Jul 25, 2024 · ABF is a type of film dielectric that comes packaged as a roll; the important ABF film is bondable to other HDI materials or organic resin-based substrates for use in HDI PCBs and IC packages. Specifically, it is packaged between a polyethylene (PET) release film and an ortho-phenylphenol (OPP) protective film on the material roll.

Apr 30, 2018 · The ABF-RCC consists of a three layer structure; 38 µm PET support film, an alkaline-soluble resin release layer, and a very thin vacuum evaporated copper layer (0.1 – 2 µm). Similar to the coating process for standard ABF, the alkaline-soluble release layer is coated onto the PET carrier and dried.

Jan 17, 2025 · ABF's thin film thickness is ideal for creating high layer count stackups, a key requirement in HDI and UHDI PCBs. This property allows designers to pack more interconnects into smaller spaces, enabling compact and high-performance designs.

Low Df and Smoother Surface( skin effect ) are the key to achieve lower transmission loss. GL showed good Frequency stability. Fine Line by Semi Additive Process.

Ajinomoto Build-up Film® (ABF) continues to achieve high levels of growth as the de facto standard in the semiconductor market, which is anticipated to reach ¥100 trillion in 2030. What is the secret behind its overwhelming dominance? What strengths have led to the continued use of ABF in the semiconductor industry for so many years?