In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.

Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.

Aug 14, 2020 · Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs.

Oct 7, 2019 · Samsung’s 12-layer DRAM KGSDs (known good stack die) will feature 60,000 TSV holes which is why the manufacturer considers its technology one of the most challenging packaging for mass production.

Jan 2, 2019 · • Updating the hardware list using TSV & other 3D stacking technologies with focus on GPUs for High Performance Computing (HPC) in addition to MEMS & Sensors for mid / low end market segment • Updating the 3D integration markets by …

Aug 27, 2014 · Samsung Electronic announced that it has started mass producing the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology.

Comparison of Through-Silicon Via (TSV) 3D Technology and Monolithic 3D Technology

The key TSV processes to be discussed in this paper are TSV formation, thin wafer handling, Cu plating and wafer thinning/CMP to form 3D interconnects. Characterization, advantages and challenges associated with each of these process steps and …

Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.

3D is becoming a key technology platform for increase integration, either for heterogeneous integration (like for MEMS and CMOS image sensor) or for increasing the performances (like for DRAM and IC partitioning). When a company has started to adopt TSV, there is no turning back.