Thanks to Intel's Foveros 3D packaging technology, the Lakefield processors are dramatically smaller than other mobile CPUs, enabling OEMs to create new ultra-light and innovative PC form factors ...

The company has already been heading down this path with its Embedded Multi-die Interconnect Bridge and Foveros 3D packaging technologies—the latter of which is used for Intel’s new Lakefield ...

We are back after a week off! This week on the podcast we talk about our four reviews, big Intel Xe leaks, Apple possibly sourcing AMD for CPUs, some gaming news and more! Show Notes & More ...

Intel has released its latest WHQL-signed Windows driver for 7th Gen (Kaby Lake) CPUs all the way up to the 10th Gen (Comet Lake/Ice Lake) chips, as well as Lakefield. If you recall, Lakefield was ...

Back at its Architecture Day 2021 event, when Intel shared the core design details ... even when using an older Lakefield CPU. Fast forward to August of 2022 and things are looking quite different ...

It's the first laptop carrying an Intel Lakefield processor, a hybrid chip that's essentially Intel's attempt to take on the aforementioned Snapdragon series at its own game. Everything clear so far?