Next-generation optical inspection is about more than sensitivity. It’s about seeing reliably through complexity.

Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection ...

The heat dissipation of power amplifier (PA) chips is one of the biggest challenges in the development of miniaturized state of art glass-based high-power RF modules. Glass has excellent electrical ...

The effect: the nails look as if they have been coated with a wafer-thin layer of glass—shiny, clear, and yet totally natural ...

To solve the problem of high dielectric loss of glass in mm-W/THz bands, we proposed two types of low-cost and low-loss air-filled transmission lines based on advanced glass wafer packaging. They are ...