Ball Grid Array (BGA) Package Market To Reach US$ 7.15 Billion By 2032 With A 5.03% CAGR
Global Ball Grid Array Package Market Research Report: By Type, Application, Material, End Use, Regional ...
Semiconductor Packaging News33m
VIEWPOINT 2025: Mike Dube, Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics
Mike Dube, Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics ...
Design-Reuse9d
New 64-Bit RISC Microprocessor from Toshiba Utilizes 0.13-Micron Process Technology to Achieve 300MHz Operating Frequency
A reference board for testing is in development and is expected to be available after the sampling phase. Package Plastic ball grid array, 484-pin, 35 millimeters (mm) x 35mm, 2.3mm thickness with ...
Nature4d
Moisture Diffusion and Delamination in Electronic Packaging
Additionally, studies have investigated moisture diffusion within specific package types, such as flip chip plastic ball grid arrays (FC-PBGA). By integrating impedance sensors within the back-end ...
Design-Reuse9d
Motorola Ships World's First StarCore-Based DSP Product
It is designed to significantly reduce overall system power consumption and to allow use of a high-density 17mm x 17mm Flip-Chip Plastic Ball Grid Array (FC-PBGA) package. One of the unique features ...
IEEE13d
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel
DDR4 ball grid array package develops partial connection defect during device operation. Electrical model of defect is presented and Ansys software is used to extract resistance, inductance and ...