News

Hosted on MSN19d
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks
the company announced at its European Open Innovation Platform (OIP) forum this month. The new packaging method will address the most performance-hungry applications and let AI and HPC chip ...
Design-Reuse2y
eMemory Receives 2022 TSMC OIP Partner of the Year Award for Embedded Memory IP
Hsinchu Taiwan, November 7th, 2022 – eMemory has been recognized by TSMC as a recipient of its 2022 Open Innovation Platform® OIP Partner of the Year award for Specialty Embedded Memory IP. The OIP ...