Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...

According to Nikkei Asia, wire bonding machines, wafer dicers, and laser drilling machines are all in short supply, with orders for new machines booked out for a year. Like toilet paper this time ...

Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads. It is vital that the interconnection corresponds to the product-specific bonding diagram ...

Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging ...