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This image shows those connections which use magnet wire on a DIP breakout board. [Jason] used epoxy to glue the wafer down before grabbing his iron. It took 90 minutes to solder the nine ...
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TSMC takes 'chip binning' to a whole new level as entire wafer 'found in a dumpster'Not wirecutter - a wire cutter, that is a machine with a thin wire that cuts wafer into chips and minimizes dust. After that, you need an assembly machine that will place your chips onto a ...
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