Dice being singulated with a diamond saw The general plan is to use testing at a variety of points to improve overall quality, by weeding out bad wafers (PCM data) bad die (wafer probe ...

But that requires backside grinding of a 300mm wafer of 775µm down to 100µm or less, which makes die more vulnerable to cracking during die singulation (a.k.a. wafer dicing) [1,2] and the handling ...

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.