And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe ... flip-chip ball grid array packages for various networking, storage, computing, automotive ...

A new way to make ultra-thin diamond wafers using sticky tape could help ... Diamond could be the super semiconductor the US power grid needs The hidden semiconductor abilities of diamonds could ...

Applying a front finger grid design to all EpiRef wafers, the team observed that each of the three devices could potentially achieve a power conversion efficiency exceeding 25%. They also noted ...

The evolution in semiconductor technology that builds a gigantic circuit on an entire wafer. Just as the integrated circuit eliminated cutting apart thousands of transistors from the wafer only to ...

Wafer prices in China on the rise ... that this week’s price hike is primarily due to an installation rush for grid-connected projects ahead of policy deadlines (April 30/May 31) to secure ...

This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications. The new test ...