which makes die more vulnerable to cracking during die singulation (a.k.a. wafer dicing) [1,2] and the handling processes that follow. Die cracks at the dicing site, on the die surface, below the ...

At some point, the wafer or a wafer-like structure is diced into individual dies or IC packages, depending on the process. The dicing step can cause defects as well as sidewall cracks on selected ...