Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

In the 3D-IC space, Cadence offers a comprehensive chiplet design and packaging solution for TSMC’s 3DFabric. The company is expanding its IP portfolio for AI training applications with TSMC9000 ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for ...

RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC's advanced silicon process A16™ with Super Power Rail, a best-in-class backside power delivery solution for analog/block ...

--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through ...

The Cadence EMX Planar 3D Solver is certified for TSMC’s N3 node and is undergoing N2P certification to meet advanced-node IC demands.

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...